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Alpha™ Specifications
Designed to test QFN, DFN, QFP, and SO IC packages for most handler platforms, the Alpha™ Test Contacting Solution gives you visible results, lowering your cost of test, higher yields and up- binning of your product.
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| Electrical Specification | |||||
| 1 | Electrical Length (mm) | — | — | ||
| 2 | Inductance | Self (nH) | 3.54 | 3.54 | |
| Mutual (nH) | — | — | |||
| 3 | Capacitance | Self (pH) | — | — | |
| Mutual (pH) | — | — | |||
| 4 | S21 (Insertion Loss/Bandwidth) | — | — | ||
| 5 | S11 (Return Loss/Bandwidth) | — | — | ||
| 6 | S41 (Crosstalk/Bandwidth) | — | — | ||
| 7 | Contact DC Resistance (mohm) | 10.0 | <= 30.0 | ||
| 8 | Current Carrying Capacity (A) | 4.00 | 4.00 | ||
| 9 | Current Leakage (pA) @ 10V | — | — | ||
| 10 | Decoupling Area (mm) | — | — | ||
| 11 | Peak Current (A @ 1ms) | 30.00 | 30.00 | ||
| Mechanical Specifications | ||||
| 1 | Physical Pin Length (mm) | — | — | |
| 2 | Pin Uncompressed Height (mm) | 3.43 | 3.43 | |
| 3 | Pin Compliance (mm) | 0.200 | 0.200 | |
| 4 | Pin Tip Coplanarity (mm) | — | — | |
| 5 | Pin Wiping Length (mm) | <= 0.15 | <= 0.15 | |
| 6 | Gram Force Per Pin (g) | 20 to 30 | 20 to 30 | |
| 7 | Number Of Insertion | Housing | >= 6 Millions | >= 6 Millions |
| Pin (Matte Tin) | >= 500K | >= 500K | ||
| Pin (NiPd) | >= 500K | >= 500K | ||
| 8 | Operating Temperature © | -45 to 155 | -45 to 155 | |
| 9 | Socket Material | TORLON 5030 | TORLON 5030 | |
| 10 | Pin Material | BeCu-Ni-Au | BeCu-Ni-Au | |
| Mechanical robustness: Rated for hundreds of thousands of IC package insertions for high-volume production test environments | |
| Versatile and cost effective: Easy replacement of contacts to reduce MTBA, improving up-time and lowering cost-of-test | |
| Thermal Conditioning Channels (TCC) Technology: Ability to efficiently thermal condition IC package and test contactor components to maintain ±2°C test temperature | |
| Short Wiping Stroke (SWS) Technology: Micro-wipe provides consistent performance results while minimizing debris generation. Ideal for today’s shorter lead geometry configurations | |
| Advance Contact Finish (ACF) Technology: Extends maintenance intervals by reducing plating transfer buildup and loose debris |
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Conductive Flat/Solid
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Hinged Contact Insert(HCIE)
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Non-Conductive Flat with Contacts
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